EP2A15F672C9N vs EP2A15F672C7 Vergleich
Detaillierter Direktvergleich von EP2A15F672C9N von Intel und EP2A15F672C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A15F672C9N | EP2A15F672C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $155,00 | $98,00 |
| Logic Family | APEX II (CMOS) | — |
| Series | Altera APEX II (EP2A) | APEX II (EP2A15) |
| Logic Elements / Cells | 16,640 | — |
| Equivalent Gates | 600,000 | — |
| Maximum User I/O Pins | 492 | — |
| Propagation Delay | 1.94 ns | — |
| Internal Operating Frequency (max) | 379 MHz | — |
| Technology Process | 0.15 µm all-layer copper CMOS, up to 8 metal layers | — |
| Core Supply Voltage | 1.5 V | — |
| Gehäuse | 672-ball FC-FBGA (27 x 27 mm, 1 mm pitch, FineLine BGA) | 672-ball FineLine BGA (FCBGA) |
| Betriebstemperatur | 0°C to +85°C (commercial grade) | Commercial (0°C to +85°C) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (per FC-FBGA moisture sensitivity, typical) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| I/O Speed Grade | Up to 1 Gbps (LVDS) | — |
| Embedded Memory | Embedded dual-port RAM blocks | — |
| Special Blocks | CAM (Content-Addressable Memory), dedicated multipliers, PLLs | — |
| Speed Grade | C9 (fastest commercial grade in the APEX II speed-grade system) | C7 |
| Family | — | APEX II FPGA |
| Logic Elements (LE) | — | 16,640 |
| Total System Gates | — | 425,984 |
| Maximum User I/O | — | 492 |
| Embedded Memory Bits | — | 425,984 |
| Number of Macrocells / Logic Units | — | 16,640 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Core Voltage | — | 1.5 V |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standard | — | True-LVDS, LVPECL, PCML, HyperTransport |
| True-LVDS Data Rate | — | 1 Gbps |
| Package Dimensions | — | 27 mm × 27 mm, 1.0 mm pitch |