EP2A15F672C9N vs EP2A15F672C7 Comparação
Comparação detalhada lado a lado de EP2A15F672C9N por Intel e EP2A15F672C7 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2A15F672C9N | EP2A15F672C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | NRND | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $155,00 | $98,00 |
| Logic Family | APEX II (CMOS) | — |
| Series | Altera APEX II (EP2A) | APEX II (EP2A15) |
| Logic Elements / Cells | 16,640 | — |
| Equivalent Gates | 600,000 | — |
| Maximum User I/O Pins | 492 | — |
| Propagation Delay | 1.94 ns | — |
| Internal Operating Frequency (max) | 379 MHz | — |
| Technology Process | 0.15 µm all-layer copper CMOS, up to 8 metal layers | — |
| Core Supply Voltage | 1.5 V | — |
| Encapsulamento | 672-ball FC-FBGA (27 x 27 mm, 1 mm pitch, FineLine BGA) | 672-ball FineLine BGA (FCBGA) |
| Temperatura de operação | 0°C to +85°C (commercial grade) | Commercial (0°C to +85°C) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Nível MSL | 3 (per FC-FBGA moisture sensitivity, typical) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| I/O Speed Grade | Up to 1 Gbps (LVDS) | — |
| Embedded Memory | Embedded dual-port RAM blocks | — |
| Special Blocks | CAM (Content-Addressable Memory), dedicated multipliers, PLLs | — |
| Speed Grade | C9 (fastest commercial grade in the APEX II speed-grade system) | C7 |
| Family | — | APEX II FPGA |
| Logic Elements (LE) | — | 16,640 |
| Total System Gates | — | 425,984 |
| Maximum User I/O | — | 492 |
| Embedded Memory Bits | — | 425,984 |
| Number of Macrocells / Logic Units | — | 16,640 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Core Voltage | — | 1.5 V |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standard | — | True-LVDS, LVPECL, PCML, HyperTransport |
| True-LVDS Data Rate | — | 1 Gbps |
| Package Dimensions | — | 27 mm × 27 mm, 1.0 mm pitch |