EP2A25F672C8N vs EP2A25F672I6 Vergleich

Detaillierter Direktvergleich von EP2A25F672C8N von Intel und EP2A25F672I6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A25F672C8N EP2A25F672I6
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $205,00 $178,00
Family APEX II APEX II
Technology Node 0.15 um all-layer copper process —
System Gates 900,000 —
Logic Elements / Cells 24,320 —
Maximum Internal Frequency 333 MHz —
Propagation Delay 1.69 ns —
User I/Os 492 —
Gehäuse 672-ball FC-FBGA (FineLine BGA) 672-ball FineLine BGA (FBGA-672)
Package Body Size 27 x 27 mm —
Ball Pitch 1.0 mm —
Core Supply Voltage 1.5 V —
Speed Grade C8 6
Betriebstemperatur 0 C to 85 C (commercial) —
Multi-Gigabit Transceiver Rate Up to 1 Gbps per channel —
Montageart Surface Mount Surface Mount (BGA)
RoHS-Status Compliant [DATA_NEEDED: RoHS compliance status]
Lead-Free Suffix N (lead-free, Pb-free finish) —
Logic Elements (typical gates) — 25,000
Fabric Architecture — SRAM-based LUT
Process Technology — 0.18 µm CMOS
Core Voltage — 1.5 V
Configuration Method — External SRAM configuration device (EPC series)
Temperature Grade — Industrial (-40 °C to +100 °C ambient)
Embedded Memory — Embedded System Blocks (ESB), dual-port RAM / CAM
DSP Blocks — MultiCore dedicated multipliers
Boundary Scan — JTAG (IEEE 1149.1) compliant
Clock Management — Dedicated PLL / clock tree circuitry
I/O Bank Count — [DATA_NEEDED: number of user I/O banks]
Lead-Free — [DATA_NEEDED: lead-free status]
MSL-Level — [DATA_NEEDED: moisture sensitivity level]

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