EP2A25F672C9ES vs EP2A25F672C9N Vergleich

Detaillierter Direktvergleich von EP2A25F672C9ES von Intel und EP2A25F672C9N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2A25F672C9ES EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel

EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel

EP2A25F672C9ES ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2A25F672C9ES EP2A25F672C9N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $122,00 $195,00
Family APEX II APEX II
Logic Elements 24,320 —
System Gates 900,000 Approx. 900000
Maximum Operating Frequency 236 MHz —
Propagation Delay 1.69 ns 2.23 ns
Process Technology 0.15 µm CMOS (up to 8 metal layers, all-layer copper) 0.15 µm all-layer copper, up to 8 metal layers
Core Supply Voltage 1.5 V —
User I/Os 492 —
Gehäuse 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch
Speed Grade -9 —
Configuration Class ES (Enhanced) —
Betriebstemperatur 0 °C to 85 °C (Commercial) 0 °C to +85 °C (commercial, C9 grade)
Montageart Surface Mount Surface Mount (BGA)
RoHS-Status [DATA_NEEDED: RoHS compliance status] Compliant (per distributor listings)
MSL-Level [DATA_NEEDED: MSL moisture sensitivity level] —
Logic Family CMOS CMOS
Logic Elements / Cells — 24320
Maximum User I/O — 492
Operating Frequency — 236 MHz
Core Supply Voltage (VCCINT) — 1.425 V to 1.575 V (nominal 1.5 V)
Seated Height (max) — 2.100 mm
I/O Standards Supported — LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport
LVDS Data Rate — Up to 1 Gbps (True-LVDS)
Configuration Interface — Serial / Parallel PROM, JTAG, passive parallel (enhanced)
Embedded Memory — Enhanced System Blocks (ESBs) for dual-port RAM
Design Software — Quartus II (v5.1 or later)

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