EP2A25F672C9ES vs EP2A25F672C9N 对比
详细并排对比 EP2A25F672C9ES 出自 Intel 和 EP2A25F672C9N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2A25F672C9ES | EP2A25F672C9N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $122.00 | $195.00 |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| System Gates | 900,000 | Approx. 900000 |
| Maximum Operating Frequency | 236 MHz | — |
| Propagation Delay | 1.69 ns | 2.23 ns |
| Process Technology | 0.15 µm CMOS (up to 8 metal layers, all-layer copper) | 0.15 µm all-layer copper, up to 8 metal layers |
| Core Supply Voltage | 1.5 V | — |
| User I/Os | 492 | — |
| 封装 | 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch |
| Speed Grade | -9 | — |
| Configuration Class | ES (Enhanced) | — |
| 工作温度 | 0 °C to 85 °C (Commercial) | 0 °C to +85 °C (commercial, C9 grade) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listings) |
| MSL 等级 | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Logic Family | CMOS | CMOS |
| Logic Elements / Cells | — | 24320 |
| Maximum User I/O | — | 492 |
| Operating Frequency | — | 236 MHz |
| Core Supply Voltage (VCCINT) | — | 1.425 V to 1.575 V (nominal 1.5 V) |
| Seated Height (max) | — | 2.100 mm |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Interface | — | Serial / Parallel PROM, JTAG, passive parallel (enhanced) |
| Embedded Memory | — | Enhanced System Blocks (ESBs) for dual-port RAM |
| Design Software | — | Quartus II (v5.1 or later) |