EP2A25F672C9N vs EP2A25F672C7N Vergleich
Detaillierter Direktvergleich von EP2A25F672C9N von Intel und EP2A25F672C7N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A25F672C9N | EP2A25F672C7N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $195,00 |
| Family | APEX II | APEX II |
| Logic Elements / Cells | 24320 | — |
| System Gates | Approx. 900000 | Approximately 900,000 |
| Maximum User I/O | 492 | — |
| Operating Frequency | 236 MHz | — |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (nominal 1.5 V) | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper (up to 8 metal layers) |
| Gehäuse | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Seated Height (max) | 2.100 mm | — |
| Propagation Delay | 2.23 ns | — |
| Logic Family | CMOS | CMOS |
| Betriebstemperatur | 0 °C to +85 °C (commercial, C9 grade) | 0 °C to 85 °C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Configuration Interface | Serial / Parallel PROM, JTAG, passive parallel (enhanced) | — |
| Embedded Memory | Enhanced System Blocks (ESBs) for dual-port RAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| Design Software | Quartus II (v5.1 or later) | — |
| RoHS-Status | Compliant (per distributor listings) | [DATA_NEEDED: RoHS compliance] |
| Logic Elements | — | 24,320 cells |
| User I/Os | — | 492 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Internal Operating Frequency | — | Up to 500 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| Package Type | — | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| High-Speed I/O Support | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | — | Loadable PLD (in-system programmable) |
| PLLs | — | Up to 4 |