EP2A25F672C9N vs EP2A25F672C7N Comparaison
Comparaison détaillée côte à côte de EP2A25F672C9N par Intel et EP2A25F672C7N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A25F672C9N | EP2A25F672C7N |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $195,00 | $195,00 |
| Family | APEX II | APEX II |
| Logic Elements / Cells | 24320 | — |
| System Gates | Approx. 900000 | Approximately 900,000 |
| Maximum User I/O | 492 | — |
| Operating Frequency | 236 MHz | — |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (nominal 1.5 V) | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper (up to 8 metal layers) |
| Boîtier | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Seated Height (max) | 2.100 mm | — |
| Propagation Delay | 2.23 ns | — |
| Logic Family | CMOS | CMOS |
| Température de fonctionnement | 0 °C to +85 °C (commercial, C9 grade) | 0 °C to 85 °C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Configuration Interface | Serial / Parallel PROM, JTAG, passive parallel (enhanced) | — |
| Embedded Memory | Enhanced System Blocks (ESBs) for dual-port RAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| Design Software | Quartus II (v5.1 or later) | — |
| Statut RoHS | Compliant (per distributor listings) | [DATA_NEEDED: RoHS compliance] |
| Logic Elements | — | 24,320 cells |
| User I/Os | — | 492 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Internal Operating Frequency | — | Up to 500 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| Package Type | — | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| High-Speed I/O Support | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | — | Loadable PLD (in-system programmable) |
| PLLs | — | Up to 4 |