EP2A25F672I-7 vs EP2A25F672C8N Vergleich
Detaillierter Direktvergleich von EP2A25F672I-7 von Intel und EP2A25F672C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A25F672I-7 | EP2A25F672C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $205,00 |
| Family | APEX II | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| System Gates | 900K (approximately) | 900,000 |
| Logic Cells / Elements | 24,320 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 0.15 um | — |
| Core Voltage | 1.5 V | — |
| Gehäuse | 672-pin FC-FBGA | 672-ball FC-FBGA (FineLine BGA) |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Speed Grade | -7 | C8 |
| Betriebstemperatur | -40C to +85C (Industrial) | 0 C to 85 C (commercial) |
| Temperature Grade | Industrial (I) | — |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| JTAG Support | IEEE 1149.1 Boundary Scan | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | Compliant |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Embedded Memory | ESBs (Embedded System Blocks) | — |
| Technology Node | — | 0.15 um all-layer copper process |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |