EP2A25F672I-7 vs EP2A25F672C8N Comparaison
Comparaison détaillée côte à côte de EP2A25F672I-7 par Intel et EP2A25F672C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A25F672I-7 | EP2A25F672C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $171,00 | $205,00 |
| Family | APEX II | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| System Gates | 900K (approximately) | 900,000 |
| Logic Cells / Elements | 24,320 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 0.15 um | — |
| Core Voltage | 1.5 V | — |
| Boîtier | 672-pin FC-FBGA | 672-ball FC-FBGA (FineLine BGA) |
| Type de montage | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Speed Grade | -7 | C8 |
| Température de fonctionnement | -40C to +85C (Industrial) | 0 C to 85 C (commercial) |
| Temperature Grade | Industrial (I) | — |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| JTAG Support | IEEE 1149.1 Boundary Scan | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Embedded Memory | ESBs (Embedded System Blocks) | — |
| Technology Node | — | 0.15 um all-layer copper process |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |