EP2A25F672I6 vs EP2A25F672C9 Vergleich

Detaillierter Direktvergleich von EP2A25F672I6 von Intel und EP2A25F672C9 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A25F672I6 EP2A25F672C9
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $178,00 $700,00
Family APEX II APEX II
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS 0.15 µm all-layer copper, up to 8 metal layers
Gehäuse 672-ball FineLine BGA (FBGA-672) 672-ball FCBGA (FineLine BGA)
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 —
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM ESBs for dual-port RAM, ROM, FIFO
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED]
Lead-Free [DATA_NEEDED: lead-free status] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Montageart Surface Mount (BGA) Surface Mount
Logic Elements (LE) — Approximately 25,000
Macro Cells — 2432
User I/O — 492
Package Dimensions — 27 mm x 27 mm
Ball Pitch — 1.0 mm
Logic Family — CMOS
Propagation Delay — 1.69 ns
Betriebstemperatur — 0°C to 85°C (Commercial)
Versorgungsspannung — [DATA_NEEDED: core VCC voltage]
I/O Standards — LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V)
Configuration — Passive Serial, Passive Parallel Synchronous, JTAG

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern