EP2A40B724C9 vs EP2A40B724I-7 Vergleich

Detaillierter Direktvergleich von EP2A40B724C9 von Altera und EP2A40B724I-7 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A40B724C9 EP2A40B724I-7
Marke Altera Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $395,38 $158,00
Series APEX II —
Logic Elements (LE) 38,400 —
Embedded RAM Bits 655,360 (approximately 655 Kbits / 80 Kbytes) —
Number of User I/O 540 —
Betriebsversorgungsspannung 1.425 V to 1.575 V (core) —
MultiVolt I/O Support 1.5 V, 1.8 V, 2.5 V, 3.3 V —
Gehäuse / Bauform 724-BBGA, FCBGA (Flip-Chip BGA) —
Supplier Device Package 724-BGA (35x35 mm) —
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur 0C to +85C —
Shipping Medium Tray —
MSL-Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
Architecture LUT-based with embedded memory blocks —
Typical Core Power [DATA_NEEDED: ICCDAT typical] —
Family — APEX II
Logic Elements — 40,000 LE
Embedded Memory — 1.5 Mbit (ESB)
Maximum User I/O — [DATA_NEEDED: max user I/O count]
Number of PLLs — 4
Operating Temperature Grade — Industrial (-40C to +100C)
Speed Grade — -7
Gehäuse — BGA-724 (724-ball FineLine BGA)
Package Footprint — 33 x 33 mm
Ball Pitch — 1.27 mm
Peak Reflow Temperature — 220 C
Configuration Mode — Enhanced configuration device / fast serial
Process Technology — [DATA_NEEDED: process node]
I/O Standard Support — LVTTL / LVCMOS 1.5V, 1.8V, 2.5V, 3.3V

Datenblätter & Ressourcen

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