EP2A40F672C6N vs EP2A40F672C9N Vergleich
Detaillierter Direktvergleich von EP2A40F672C6N von Intel und EP2A40F672C9N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A40F672C6N | EP2A40F672C9N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $165,00 | $295,00 |
| Family | APEX II | APEX II |
| Logic Elements | 40,000 | 38,400 |
| Maximum System Gates | 1,125,000 | — |
| Embedded RAM Bits | 442,368 | — |
| Embedded System Blocks (ESBs) | 160 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V | — |
| Gehäuse | 672-ball FineLine BGA | BGA-672 (27 x 27 mm, 1.0 mm pitch) |
| Betriebstemperatur | Commercial (0C to +85C) | 0 °C to +85 °C (commercial) |
| Speed Grade | C6 (per part number suffix) | C9 (~1.55 ns propagation delay) |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) | 0.15 µm all-layer copper, up to 8 metal layers |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Device Name | — | EP2A40 |
| System Gates | — | 1,500,000 |
| User I/Os | — | 492 |
| Embedded RAM (ESB) | — | [DATA_NEEDED: ESB total RAM bits] |
| Package Code | — | FC-FBGA / PBGA672 |
| Internal Frequency | — | 366 MHz |
| LVDS Data Rate | — | 1 Gbps |
| Propagation Delay | — | 1.55 ns |
| Logic Family | — | CMOS (SRAM-based configuration) |