EP2A40F672C6N vs EP2A40F672C9N Comparaison
Comparaison détaillée côte à côte de EP2A40F672C6N par Intel et EP2A40F672C9N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40F672C6N | EP2A40F672C9N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $165,00 | $295,00 |
| Family | APEX II | APEX II |
| Logic Elements | 40,000 | 38,400 |
| Maximum System Gates | 1,125,000 | — |
| Embedded RAM Bits | 442,368 | — |
| Embedded System Blocks (ESBs) | 160 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V | — |
| Boîtier | 672-ball FineLine BGA | BGA-672 (27 x 27 mm, 1.0 mm pitch) |
| Température de fonctionnement | Commercial (0C to +85C) | 0 °C to +85 °C (commercial) |
| Speed Grade | C6 (per part number suffix) | C9 (~1.55 ns propagation delay) |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) | 0.15 µm all-layer copper, up to 8 metal layers |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Device Name | — | EP2A40 |
| System Gates | — | 1,500,000 |
| User I/Os | — | 492 |
| Embedded RAM (ESB) | — | [DATA_NEEDED: ESB total RAM bits] |
| Package Code | — | FC-FBGA / PBGA672 |
| Internal Frequency | — | 366 MHz |
| LVDS Data Rate | — | 1 Gbps |
| Propagation Delay | — | 1.55 ns |
| Logic Family | — | CMOS (SRAM-based configuration) |