EP2A40F672C7 vs EP2A40F672C7N Vergleich
Detaillierter Direktvergleich von EP2A40F672C7 von Intel und EP2A40F672C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A40F672C7 | EP2A40F672C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $198,00 |
| Family | APEX II | APEX II |
| Logic Elements | 38,400 | — |
| System Gates | 1,500,000 | 1.5 M |
| Macro Cells | 2,560 | — |
| Maximum User I/O | 492 | — |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Pin-to-Pin Delay | 1.55 ns (C7 speed grade) | — |
| Maximum Internal Frequency | 562 MHz | — |
| High-Speed Interface | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport | — |
| PLLs | 4 | — |
| Gehäuse | 672-ball FC-FBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA), S-PBGA-B672, 27 x 27 mm, 1.0 mm pitch |
| Package Dimensions | 27 x 27 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount | Surface Mount |
| Operating Temperature Grade | Commercial (per 'C' suffix in speed grade) | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Logic Elements / Cells | — | 38,400 |
| Maximum User I/Os | — | 492 |
| Propagation Delay (tpd) | — | 1.55 ns |
| Internal Performance | — | 562 MHz |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Logic Family | — | CMOS |
| Betriebstemperatur | — | 0 °C to 85 °C (commercial, 'C' grade) |
| Speed Grade | — | 7 |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Modes | — | Passive Serial, Passive Parallel, JTAG |