EP2A40F672C7 vs EP2A40F672C7N Comparación
Comparación detallada lado a lado de EP2A40F672C7 por Intel y EP2A40F672C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F672C7 | EP2A40F672C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $195,00 | $198,00 |
| Family | APEX II | APEX II |
| Logic Elements | 38,400 | — |
| System Gates | 1,500,000 | 1.5 M |
| Macro Cells | 2,560 | — |
| Maximum User I/O | 492 | — |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Pin-to-Pin Delay | 1.55 ns (C7 speed grade) | — |
| Maximum Internal Frequency | 562 MHz | — |
| High-Speed Interface | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport | — |
| PLLs | 4 | — |
| Encapsulado | 672-ball FC-FBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA), S-PBGA-B672, 27 x 27 mm, 1.0 mm pitch |
| Package Dimensions | 27 x 27 mm, 1.0 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature Grade | Commercial (per 'C' suffix in speed grade) | — |
| Estado RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Logic Elements / Cells | — | 38,400 |
| Maximum User I/Os | — | 492 |
| Propagation Delay (tpd) | — | 1.55 ns |
| Internal Performance | — | 562 MHz |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Logic Family | — | CMOS |
| Temperatura de funcionamiento | — | 0 °C to 85 °C (commercial, 'C' grade) |
| Speed Grade | — | 7 |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Modes | — | Passive Serial, Passive Parallel, JTAG |