EP2A40F672C7 vs EP2A40F672C8 Vergleich
Detaillierter Direktvergleich von EP2A40F672C7 von Intel und EP2A40F672C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A40F672C7 | EP2A40F672C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $68,00 |
| Family | APEX II | APEX II |
| Logic Elements | 38,400 | — |
| System Gates | 1,500,000 | — |
| Macro Cells | 2,560 | — |
| Maximum User I/O | 492 | — |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers | 0.15-micron all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V | — |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Pin-to-Pin Delay | 1.55 ns (C7 speed grade) | — |
| Maximum Internal Frequency | 562 MHz | — |
| High-Speed Interface | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport | — |
| PLLs | 4 | — |
| Gehäuse | 672-ball FC-FBGA (FineLine BGA) | — |
| Package Dimensions | 27 x 27 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (per 'C' suffix in speed grade) | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Logic Family | — | CMOS |
| Typical Logic Elements (LEs) | — | 40,000 |
| Embedded Memory | — | Up to 1.5 Mbits |
| User I/Os | — | 492 pins |
| Anzahl der Pins | — | 672 |
| Package Type | — | FineLine BGA, 27 x 27 mm, 1.0 mm pitch |
| Propagation Delay (speed grade C8) | — | 1.55 ns |
| Betriebstemperatur | — | 0 C to 85 C (commercial) |
| Phase-Locked Loops (PLLs) | — | 4 |
| LVDS Signaling Support | — | Up to 1 Gbps |
| Multipliers | — | Embedded multiplier blocks |
| I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |