EP2A40F672C7 vs EP2A40F672C8 Comparação
Comparação detalhada lado a lado de EP2A40F672C7 por Intel e EP2A40F672C8 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2A40F672C7 | EP2A40F672C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $195,00 | $68,00 |
| Family | APEX II | APEX II |
| Logic Elements | 38,400 | — |
| System Gates | 1,500,000 | — |
| Macro Cells | 2,560 | — |
| Maximum User I/O | 492 | — |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers | 0.15-micron all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V | — |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Pin-to-Pin Delay | 1.55 ns (C7 speed grade) | — |
| Maximum Internal Frequency | 562 MHz | — |
| High-Speed Interface | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport | — |
| PLLs | 4 | — |
| Encapsulamento | 672-ball FC-FBGA (FineLine BGA) | — |
| Package Dimensions | 27 x 27 mm, 1.0 mm pitch | — |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (per 'C' suffix in speed grade) | — |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Logic Family | — | CMOS |
| Typical Logic Elements (LEs) | — | 40,000 |
| Embedded Memory | — | Up to 1.5 Mbits |
| User I/Os | — | 492 pins |
| Número de pinos | — | 672 |
| Package Type | — | FineLine BGA, 27 x 27 mm, 1.0 mm pitch |
| Propagation Delay (speed grade C8) | — | 1.55 ns |
| Temperatura de operação | — | 0 C to 85 C (commercial) |
| Phase-Locked Loops (PLLs) | — | 4 |
| LVDS Signaling Support | — | Up to 1 Gbps |
| Multipliers | — | Embedded multiplier blocks |
| I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |