EP2A40F672C8 vs EP2A40F672C7ES Vergleich
Detaillierter Direktvergleich von EP2A40F672C8 von Intel und EP2A40F672C7ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A40F672C8 | EP2A40F672C7ES |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $68,00 | $124,75 |
| Family | APEX II | APEX II |
| Logic Family | CMOS | — |
| Typical Logic Elements (LEs) | 40,000 | — |
| Embedded Memory | Up to 1.5 Mbits | — |
| User I/Os | 492 pins | — |
| Anzahl der Pins | 672 | — |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch | — |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers | 0.15 µm CMOS |
| Propagation Delay (speed grade C8) | 1.55 ns | — |
| Betriebstemperatur | 0 C to 85 C (commercial) | 0 °C to +85 °C (commercial) |
| Phase-Locked Loops (PLLs) | 4 | — |
| LVDS Signaling Support | Up to 1 Gbps | — |
| Multipliers | Embedded multiplier blocks | — |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 38400 |
| Typical Gates | — | 1.5 M |
| Maximum Logic Elements | — | 40960 |
| Maximum Macro Cells | — | 2560 |
| Maximum User I/O | — | 492 |
| Maximum Operating Frequency | — | 562 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 3.3 V |
| Gehäuse | — | 672-pin FC-FBGA (FineLine BGA) |
| Package Dimensions | — | 27 × 27 mm |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | 7 |
| Status Code | — | ES (Engineering Sample) |
| RoHS-Status | — | [DATA_NEEDED: rohs status] |