EP2A40F672C8 vs EP2A40F672C7ES Comparación
Comparación detallada lado a lado de EP2A40F672C8 por Intel y EP2A40F672C7ES por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F672C8 | EP2A40F672C7ES |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $68,00 | $124,75 |
| Family | APEX II | APEX II |
| Logic Family | CMOS | — |
| Typical Logic Elements (LEs) | 40,000 | — |
| Embedded Memory | Up to 1.5 Mbits | — |
| User I/Os | 492 pins | — |
| Número de pines | 672 | — |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch | — |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers | 0.15 µm CMOS |
| Propagation Delay (speed grade C8) | 1.55 ns | — |
| Temperatura de funcionamiento | 0 C to 85 C (commercial) | 0 °C to +85 °C (commercial) |
| Phase-Locked Loops (PLLs) | 4 | — |
| LVDS Signaling Support | Up to 1 Gbps | — |
| Multipliers | Embedded multiplier blocks | — |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 38400 |
| Typical Gates | — | 1.5 M |
| Maximum Logic Elements | — | 40960 |
| Maximum Macro Cells | — | 2560 |
| Maximum User I/O | — | 492 |
| Maximum Operating Frequency | — | 562 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 3.3 V |
| Encapsulado | — | 672-pin FC-FBGA (FineLine BGA) |
| Package Dimensions | — | 27 × 27 mm |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | 7 |
| Status Code | — | ES (Engineering Sample) |
| Estado RoHS | — | [DATA_NEEDED: rohs status] |