EP2A40F672C9N vs EP2A40F672C6N Vergleich
Detaillierter Direktvergleich von EP2A40F672C9N von Intel und EP2A40F672C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A40F672C9N | EP2A40F672C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $295,00 | $165,00 |
| Family | APEX II | APEX II |
| Device Name | EP2A40 | — |
| System Gates | 1,500,000 | — |
| Logic Elements | 38,400 | 40,000 |
| User I/Os | 492 | — |
| Embedded RAM (ESB) | [DATA_NEEDED: ESB total RAM bits] | — |
| Gehäuse | BGA-672 (27 x 27 mm, 1.0 mm pitch) | 672-ball FineLine BGA |
| Package Code | FC-FBGA / PBGA672 | — |
| Speed Grade | C9 (~1.55 ns propagation delay) | C6 (per part number suffix) |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | SRAM-based, 0.18 um (per family datasheet) |
| Core Voltage | 1.5 V | 1.5 V |
| Internal Frequency | 366 MHz | — |
| LVDS Data Rate | 1 Gbps | — |
| Propagation Delay | 1.55 ns | — |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | Commercial (0C to +85C) |
| Montageart | Surface Mount | Surface Mount |
| Logic Family | CMOS (SRAM-based configuration) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Maximum System Gates | — | 1,125,000 |
| Embedded RAM Bits | — | 442,368 |
| Embedded System Blocks (ESBs) | — | 160 |
| Maximum User I/O Pins | — | [DATA_NEEDED: maximum user I/O count] |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V |
| Configuration Methods | — | Passive Serial, Passive Parallel, JTAG |
| PLL Count | — | [DATA_NEEDED: PLL count] |