EP2A70B724C7N vs EP2A70B724I-7 Vergleich
Detaillierter Direktvergleich von EP2A70B724C7N von Altera und EP2A70B724I-7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A70B724C7N | EP2A70B724I-7 |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $188,00 | $245,00 |
| Family | APEX II (EP2A70) | APEX II |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Technology | 0.15 µm CMOS | — |
| System Gates | 3,000,000 | — |
| Logic Cells / Logic Elements | 67,200 | — |
| Maximum Internal Frequency | 420 MHz | — |
| Propagation Delay (typ.) | 2.17 ns | — |
| User I/O Pins | 536 | — |
| Macrocells (memory blocks reference) | 16 | — |
| Core Supply Voltage | 1.5 V nominal | — |
| I/O Supply Voltage | MultiVolt (1.5V / 1.8V / 2.5V / 3.3V / 5V tolerant) | — |
| Betriebstemperatur | 0 °C to +85 °C (Commercial) | — |
| Gehäuse | 724-pin FCBGA (Flip-Chip BGA) | BGA-724 |
| Ball Pitch | 1.27 mm | — |
| Seated Height | 3.5 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Method | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Embedded Memory | Embedded System Blocks (ESBs) - dual-port RAM / ROM / CAM | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS] |
| Logic Elements | — | 70,000 (EP2A70 family variant) |
| Typical Gates | — | [DATA_NEEDED: typical gate count] |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O] |
| Embedded System Blocks | — | [DATA_NEEDED: ESB count] |
| Temperature Grade | — | Industrial |
| Speed Grade | — | -7 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core VCC] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL, GTL+ |
| Configuration Interface | — | JTAG (IEEE 1149.1), Passive Serial, Active Serial |
| Process Technology | — | CMOS |
| Peak Reflow Temperature | — | 220 C |