EP2A70B724C9 vs EP2A70B724I-8 Vergleich

Detaillierter Direktvergleich von EP2A70B724C9 von Altera und EP2A70B724I-8 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A70B724C9 EP2A70B724I-8
Marke Altera Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $998,27 $119,00
Family APEX II APEX II
Logic Elements 67200 —
Embedded Memory (bits) 1146880 —
User I/O Count 540 —
Gehäuse 724-BBGA, FCBGA (FineLine BGA) —
Process Technology 0.15 um all-layer copper (up to 8 metal layers) 0.15 µm CMOS
LVDS Channels Up to 8 LVDS pairs at 1 Gbps —
I/O Standards Supported True-LVDS, LVPECL, PCML, HyperTransport —
Embedded Memory Type ESB (synchronous, self-timed WE, true dual-port / simple dual-port / single-port) —
PLLs Up to 4 [DATA_NEEDED: PLL count]
Speed Grade C9 (commercial, speed bin 9) —
Betriebstemperatur 0C to +85C (commercial) -40 °C to +100 °C (Industrial)
Supply Voltage (core) 1.5 V —
Montageart Surface Mount (BGA) Surface Mount
MSL-Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
RoHS-Status Non-compliant (per IC-Components listing) [DATA_NEEDED: RoHS compliance]
Logic Elements / Cells — 67,200 cells
System Gates — 3,000,000
Maximum Internal Frequency — 281 MHz
Core Supply Voltage — 1.5 V
I/O Supply Voltage — 3.3 V
Anzahl der Pins — 724
Package Type — FCBGA (Flip-Chip Ball Grid Array)
Peak Reflow Temperature — 220 °C (per JEDEC J-STD-020)
User I/O Banks — [DATA_NEEDED: user I/O bank count]
User I/O Pins — [DATA_NEEDED: user I/O pin count]
Embedded System Blocks (ESBs) — [DATA_NEEDED: ESB count]
Embedded Array Blocks (EABs) — [DATA_NEEDED: EAB count]
Embedded RAM — [DATA_NEEDED: total bits]
Configuration Method — JTAG / Passive Serial / Passive Parallel

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern