EP2A70B724C9 vs EP2A70B724I-8 对比

详细并排对比 EP2A70B724C9 出自 Altera 和 EP2A70B724I-8 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2A70B724C9 EP2A70B724I-8
品牌 Altera Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $998.27 $119.00
Family APEX II APEX II
Logic Elements 67200 —
Embedded Memory (bits) 1146880 —
User I/O Count 540 —
封装 724-BBGA, FCBGA (FineLine BGA) —
Process Technology 0.15 um all-layer copper (up to 8 metal layers) 0.15 µm CMOS
LVDS Channels Up to 8 LVDS pairs at 1 Gbps —
I/O Standards Supported True-LVDS, LVPECL, PCML, HyperTransport —
Embedded Memory Type ESB (synchronous, self-timed WE, true dual-port / simple dual-port / single-port) —
PLLs Up to 4 [DATA_NEEDED: PLL count]
Speed Grade C9 (commercial, speed bin 9) —
工作温度 0C to +85C (commercial) -40 °C to +100 °C (Industrial)
Supply Voltage (core) 1.5 V —
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
RoHS 状态 Non-compliant (per IC-Components listing) [DATA_NEEDED: RoHS compliance]
Logic Elements / Cells — 67,200 cells
System Gates — 3,000,000
Maximum Internal Frequency — 281 MHz
Core Supply Voltage — 1.5 V
I/O Supply Voltage — 3.3 V
引脚数 — 724
Package Type — FCBGA (Flip-Chip Ball Grid Array)
Peak Reflow Temperature — 220 °C (per JEDEC J-STD-020)
User I/O Banks — [DATA_NEEDED: user I/O bank count]
User I/O Pins — [DATA_NEEDED: user I/O pin count]
Embedded System Blocks (ESBs) — [DATA_NEEDED: ESB count]
Embedded Array Blocks (EABs) — [DATA_NEEDED: EAB count]
Embedded RAM — [DATA_NEEDED: total bits]
Configuration Method — JTAG / Passive Serial / Passive Parallel

数据手册与资源

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