EP2A70B724I8 vs EP2A70B724I9N Vergleich

Detaillierter Direktvergleich von EP2A70B724I8 von Intel und EP2A70B724I9N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A70B724I8 EP2A70B724I9N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $210,00 $152,00
Family APEX II APEX II
Logic Elements (LEs) 67200 —
System Gates 3 M (typical maximum) 3 M
Process Technology 0.15 µm CMOS 0.15 µm CMOS
Core Voltage 1.5 V —
Maximum Internal Frequency 281 MHz (typical) —
Gehäuse 724-pin FCBGA —
Pin-Anzahl 724 —
Operating Temperature (Industrial) -40 °C to +100 °C —
Speed Grade 8 —
Embedded Memory ESB / TriMatrix (size not in provided data) —
Configuration Modes Active Serial, Passive Serial, Passive Parallel Asynchronous Passive Serial, Passive Parallel, JTAG
PLL Count [DATA_NEEDED: PLL block count] —
User I/O Banks [DATA_NEEDED: bank count and I/O count] —
Multipliers Embedded multiplier blocks (count [DATA_NEEDED]) —
Supported I/O Standards LVTTL, LVCMOS, SSTL, LVDS (True-LVDS), PCI, HSTL —
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status [DATA_NEEDED: RoHS compliance] Compliant
Configuration Device Compatibility EPC4, EPC8, EPC16 (Enhanced Configuration Devices) —
Design Software Quartus II (legacy support) —
Series — EP2A70
Logic Cells — 67,200
Maximale Taktfrequenz — 198 MHz
Core Supply Voltage — 1.5 V
Package Type — 724-ball Flip-Chip BGA (FCBGA)
Maximum User I/O — 536
Embedded System Blocks — Yes (RAM/ROM/CAM)
Programmable via — IEEE 1532 / JTAG
Betriebstemperatur — -40 °C to +100 °C (Industrial)

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