EP2A70F1508C8ES vs EP2A70F1508C9 Vergleich
Detaillierter Direktvergleich von EP2A70F1508C8ES von Intel und EP2A70F1508C9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel
EP2A70F1508C8ES ⚠ Letzte BestellmöglichkeitIntel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2A70F1508C8ES | EP2A70F1508C9 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $1.310,00 |
| Family | APEX II | APEX II FPGA |
| Series | EP2A | APEX II |
| System Gates | 1,146,880 | — |
| Logic Elements | 67,200 | — |
| Embedded System Blocks (ESB) | Available (dual-port RAM/ROM/FIFO/CAM) | — |
| Maximum User I/O | 1,060 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Core Voltage | 1.5 V | — |
| Speed Grade | -8 | C9 |
| Gehäuse | 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) | — |
| Configuration Memory | SRAM (in-system programmable) | — |
| Betriebstemperatur | Commercial (0C to +85C) | 0 °C to 85 °C |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 | [DATA_NEEDED: MSL level] |
| RoHS-Status | Check manufacturer page - APEX II is a mature family with mixed compliance | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Gehäuse / Bauform | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |