EP2A70F1508C8ES vs EP2A70F1508C9 Сравнение
Подробное сравнение бок о бок EP2A70F1508C8ES от Intel и EP2A70F1508C9 от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel
EP2A70F1508C8ES ⚠ Последняя закупкаIntel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Последняя закупкаСравнение характеристик
| Параметр | EP2A70F1508C8ES | EP2A70F1508C9 |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Последняя закупка | Последняя закупка |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $0,00 | $1.310,00 |
| Family | APEX II | APEX II FPGA |
| Series | EP2A | APEX II |
| System Gates | 1,146,880 | — |
| Logic Elements | 67,200 | — |
| Embedded System Blocks (ESB) | Available (dual-port RAM/ROM/FIFO/CAM) | — |
| Maximum User I/O | 1,060 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Core Voltage | 1.5 V | — |
| Speed Grade | -8 | C9 |
| Корпус | 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) | — |
| Configuration Memory | SRAM (in-system programmable) | — |
| Рабочая температура | Commercial (0C to +85C) | 0 °C to 85 °C |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Уровень MSL | 3 | [DATA_NEEDED: MSL level] |
| Статус RoHS | Check manufacturer page - APEX II is a mature family with mixed compliance | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Корпус / Типоразмер | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |