EP2AGX125EF29I3 vs EP2AGX125EF29I5G Vergleich
Detaillierter Direktvergleich von EP2AGX125EF29I3 von Intel und EP2AGX125EF29I5G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX125EF29I3 | EP2AGX125EF29I5G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.095,00 | $861,62 |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 118,143 | — |
| Adaptive Logic Modules (ALM) | 49,640 | — |
| Logic Array Blocks (LAB) | 4,964 | — |
| Embedded Memory | 7,892 Kbit (7.93 Mbit) | — |
| User I/Os | 372 | — |
| Number of Terminals | 780 | — |
| Gehäuse / Bauform | 780-BBGA, FCBGA | — |
| Montagestil | SMD/SMT | — |
| Betriebsversorgungsspannung | 1.5 V to 3.3 V | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm |
| Betriebstemperatur | -40C to +85C (Industrial) | — |
| Speed Grade | -3 (I3) | — |
| Transceivers | Up to 12 multi-gigabit transceivers | — |
| Packaging | Tray | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 118,143 |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| Gehäuse | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |
| Montageart | — | Surface Mount (BGA) |