EP2AGX190FF35I3G vs EP2AGX190FF35I3N Vergleich

Detaillierter Direktvergleich von EP2AGX190FF35I3G von Altera und EP2AGX190FF35I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Altera
EP2AGX190FF35I3G EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G ⚠ Letzte Bestellmöglichkeit
Intel
EP2AGX190FF35I3N EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel

EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel

EP2AGX190FF35I3N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2AGX190FF35I3G EP2AGX190FF35I3N
Marke Altera Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.840,00 $1.190,00
Family Arria II GX Arria II GX
Logic Elements (LE) 181,165 —
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] —
User I/O Pins 612 612
Embedded Memory (bits) 10,177,536 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Transceivers 8 high-speed transceiver channels (multi-gigabit) —
Embedded Multipliers [DATA_NEEDED: 18x18 multiplier count] —
PLLs [DATA_NEEDED: PLL count] [DATA_NEEDED: PLL count for FF35 device]
Core Voltage 0.9 V 0.9 V
I/O Voltage Standards 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) —
Process Node 40 nm —
Betriebstemperatur -40 °C to +100 °C (industrial, suffix I) -40 °C to +100 °C (industrial, I3 grade)
Speed Grade 3 —
Gehäuse 1152-ball FC-FBGA (FF35), 35 mm body 1152-ball FC-FBGA (FCBGA), 35 mm
Ball Pitch [DATA_NEEDED: 1.0 mm (typical for FF35)] —
Montageart Surface Mount (flip-chip BGA) Surface Mount
RoHS-Status Compliant (suffix G) Compliant (per Altera/Intel product page)
Lead-Free Yes —
Programming Toolchain Quartus II / Quartus Prime —
Logic Elements — 181,165
Logic Array Blocks (LABs) — 7,612
Process Technology — 40 nm TSMC low-power
Transceiver Speed (max) — 3.75 Gbps (data rate, per family datasheet)
Total Transceivers — [DATA_NEEDED: transceiver count per FF35 package]
Embedded Memory — [DATA_NEEDED: M20K block count and total bits]
DSP Blocks — [DATA_NEEDED: variable-precision DSP block count]
Configuration — Serial / Parallel, supports encryption and remote update

Datenblätter & Ressourcen

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