EP2AGX190FF35I3G vs EP2AGX190FF35I3N 对比

详细并排对比 EP2AGX190FF35I3G 出自 Altera 和 EP2AGX190FF35I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Altera
EP2AGX190FF35I3G EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G ⚠ 最后一次采购

规格对比

参数 EP2AGX190FF35I3G EP2AGX190FF35I3N
品牌 Altera Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $1,840.00 $1,190.00
Family Arria II GX Arria II GX
Logic Elements (LE) 181,165 —
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] —
User I/O Pins 612 612
Embedded Memory (bits) 10,177,536 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Transceivers 8 high-speed transceiver channels (multi-gigabit) —
Embedded Multipliers [DATA_NEEDED: 18x18 multiplier count] —
PLLs [DATA_NEEDED: PLL count] [DATA_NEEDED: PLL count for FF35 device]
Core Voltage 0.9 V 0.9 V
I/O Voltage Standards 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) —
Process Node 40 nm —
工作温度 -40 °C to +100 °C (industrial, suffix I) -40 °C to +100 °C (industrial, I3 grade)
Speed Grade 3 —
封装 1152-ball FC-FBGA (FF35), 35 mm body 1152-ball FC-FBGA (FCBGA), 35 mm
Ball Pitch [DATA_NEEDED: 1.0 mm (typical for FF35)] —
安装类型 Surface Mount (flip-chip BGA) Surface Mount
RoHS 状态 Compliant (suffix G) Compliant (per Altera/Intel product page)
Lead-Free Yes —
Programming Toolchain Quartus II / Quartus Prime —
Logic Elements — 181,165
Logic Array Blocks (LABs) — 7,612
Process Technology — 40 nm TSMC low-power
Transceiver Speed (max) — 3.75 Gbps (data rate, per family datasheet)
Total Transceivers — [DATA_NEEDED: transceiver count per FF35 package]
Embedded Memory — [DATA_NEEDED: M20K block count and total bits]
DSP Blocks — [DATA_NEEDED: variable-precision DSP block count]
Configuration — Serial / Parallel, supports encryption and remote update

数据手册与资源

浏览全部产品 创建 BOM 获取报价