EP2AGX260EF29I5N vs EP2AGX260EF29C5N Vergleich
Detaillierter Direktvergleich von EP2AGX260EF29I5N von Intel und EP2AGX260EF29C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX260EF29I5N | EP2AGX260EF29C5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.950,00 | $1.565,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II | Arria II GX |
| Logic Elements | 244,188 | — |
| Adaptive Logic Modules (ALMs) | 10260 LABs | — |
| Embedded Memory Bits | 12,038,144 bits | — |
| Maximum User I/O | 372 | — |
| Number of I/O | 372 | 372 |
| Number of Transceivers | 12 | 12 |
| Transceiver Data Rate (CPLL) | up to 3.75 Gbps | — |
| Transceiver Data Rate (Channel PLL) | up to 5 Gbps | — |
| 18x18 Multipliers | 1,152 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 | — |
| Package Type | 780-BBGA, FCBGA (Flip-Chip BGA) | 780-BBGA, FCBGA (Flip-Chip) |
| Package Dimensions | 29 mm x 29 mm | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Lead Free | Yes | — |
| RoHS-Status | Compliant | Compliant (per DigiKey listing) |
| Process Technology | CMOS | 40 nm |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Elements (LE) | — | 244,188 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 10,238 Kbit |
| Number of LABs/CLBs | — | 10,260 |
| Number of Logic Cells | — | 244,188 |
| Transceiver Data Rate | — | Up to 5 Gbps |
| PLL Count | — | 8 (4 enhanced + 4 fast PLLs) |
| Core Voltage | — | 0.9 V |
| Betriebstemperatur | — | 0 °C to +85 °C (Commercial) |