EP2AGX260EF29I5N vs EP2AGX260EF29C5N Comparación
Comparación detallada lado a lado de EP2AGX260EF29I5N por Intel y EP2AGX260EF29C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX260EF29I5N | EP2AGX260EF29C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.950,00 | $1.565,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II | Arria II GX |
| Logic Elements | 244,188 | — |
| Adaptive Logic Modules (ALMs) | 10260 LABs | — |
| Embedded Memory Bits | 12,038,144 bits | — |
| Maximum User I/O | 372 | — |
| Number of I/O | 372 | 372 |
| Number of Transceivers | 12 | 12 |
| Transceiver Data Rate (CPLL) | up to 3.75 Gbps | — |
| Transceiver Data Rate (Channel PLL) | up to 5 Gbps | — |
| 18x18 Multipliers | 1,152 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 | — |
| Package Type | 780-BBGA, FCBGA (Flip-Chip BGA) | 780-BBGA, FCBGA (Flip-Chip) |
| Package Dimensions | 29 mm x 29 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Lead Free | Yes | — |
| Estado RoHS | Compliant | Compliant (per DigiKey listing) |
| Process Technology | CMOS | 40 nm |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Elements (LE) | — | 244,188 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 10,238 Kbit |
| Number of LABs/CLBs | — | 10,260 |
| Number of Logic Cells | — | 244,188 |
| Transceiver Data Rate | — | Up to 5 Gbps |
| PLL Count | — | 8 (4 enhanced + 4 fast PLLs) |
| Core Voltage | — | 0.9 V |
| Temperatura de funcionamiento | — | 0 °C to +85 °C (Commercial) |