EP2AGX45CU17I3G vs EP2AGX45CU17C4G Vergleich
Detaillierter Direktvergleich von EP2AGX45CU17I3G von Intel und EP2AGX45CU17C4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX45CU17I3G | EP2AGX45CU17C4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $445,00 | $145,75 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | 42,959 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | 3,517,440 |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | [DATA_NEEDED: I/O banks count] |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | — |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Gehäuse | 358-ball UBGA (FCBGA), 17x17 mm | 358-LFBGA, FCBGA |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 (168 hours) | — |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory Bits | — | 3,517,440 |
| Number of LABs/CLBs | — | 1805 |
| User I/O Count | — | 156 |
| Supply Voltage - Core | — | 0.9 V |
| Speed Grade | — | -4 |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max Gbps] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Lead-Free | — | Yes |