EP2AGX45CU17I3G vs EP2AGX45CU17C5N Vergleich
Detaillierter Direktvergleich von EP2AGX45CU17I3G von Intel und EP2AGX45CU17C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX45CU17I3G | EP2AGX45CU17C5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $445,00 | $262,00 |
| Family | Arria II GX | — |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | 1,805 |
| Total RAM Bits | 3,517,440 | — |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | 18x18 multipliers, approx. 156 |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Gehäuse | 358-ball UBGA (FCBGA), 17x17 mm | 358-ball UBGA / FCBGA |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount (BGA) | — |
| MSL-Level | 3 (168 hours) | — |
| RoHS-Status | Compliant | — |
| Device Family | — | Arria II GX |
| Device Type | — | FPGA |
| Logic Elements (LE) | — | 45,000 (approx.) |
| Embedded Memory | — | 3,517,440 bits (3.5 Mbits) |
| Adaptive Logic Modules (ALMs) | — | 17,724 (approx.) |
| User I/O Count | — | 156 |
| Multi-Gigabit Transceivers | — | Up to 8 channels at 3.75 Gbps |
| Core Voltage | — | 0.9 V (nominal) |
| Process Node | — | 40 nm TSMC |
| Operating Temperature Grade | — | Commercial (C5 speed grade) |
| Speed Grade | — | 5 (mid) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG, Enhanced Configuration Device |