EP2AGX45CU17I3G vs EP2AGX45CU17C5N Comparação
Comparação detalhada lado a lado de EP2AGX45CU17I3G por Intel e EP2AGX45CU17C5N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2AGX45CU17I3G | EP2AGX45CU17C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $445,00 | $262,00 |
| Family | Arria II GX | — |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | 1,805 |
| Total RAM Bits | 3,517,440 | — |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | 18x18 multipliers, approx. 156 |
| Temperatura de operação | -40C to +100C (Industrial) | — |
| Encapsulamento | 358-ball UBGA (FCBGA), 17x17 mm | 358-ball UBGA / FCBGA |
| Ball Pitch | 1.0 mm | — |
| Tipo de montagem | Surface Mount (BGA) | — |
| Nível MSL | 3 (168 hours) | — |
| Status RoHS | Compliant | — |
| Device Family | — | Arria II GX |
| Device Type | — | FPGA |
| Logic Elements (LE) | — | 45,000 (approx.) |
| Embedded Memory | — | 3,517,440 bits (3.5 Mbits) |
| Adaptive Logic Modules (ALMs) | — | 17,724 (approx.) |
| User I/O Count | — | 156 |
| Multi-Gigabit Transceivers | — | Up to 8 channels at 3.75 Gbps |
| Core Voltage | — | 0.9 V (nominal) |
| Process Node | — | 40 nm TSMC |
| Operating Temperature Grade | — | Commercial (C5 speed grade) |
| Speed Grade | — | 5 (mid) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG, Enhanced Configuration Device |