EP2AGX45CU17I3G vs EP2AGX45CU17I5G Vergleich
Detaillierter Direktvergleich von EP2AGX45CU17I3G von Intel und EP2AGX45CU17I5G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX45CU17I3G | EP2AGX45CU17I5G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $445,00 | $526,79 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | 42959 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | — |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Gehäuse | 358-ball UBGA (FCBGA), 17x17 mm | 358-LFBGA, FCBGA |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 (168 hours) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Number of I/O | — | 156 |
| Terminal Count | — | 358 |
| Terminal Form | — | Ball |
| Package Code | — | LFBGA |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial |
| Core Voltage | — | 0.9 V |
| Listed Operating Frequency | — | 500 MHz |
| Configuration | — | Programmable |
| REACH Status | — | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |