EP2AGX45CU17I3G vs EP2AGX45CU17I5G 비교
다음의 상세 나란히 비교: EP2AGX45CU17I3G 제조: Intel 및 EP2AGX45CU17I5G 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2AGX45CU17I3G | EP2AGX45CU17I5G |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $445.00 | $526.79 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | 42959 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | — |
| 동작 온도 | -40C to +100C (Industrial) | — |
| 패키지 | 358-ball UBGA (FCBGA), 17x17 mm | 358-LFBGA, FCBGA |
| Ball Pitch | 1.0 mm | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| MSL 레벨 | 3 (168 hours) | — |
| RoHS 상태 | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Number of I/O | — | 156 |
| Terminal Count | — | 358 |
| Terminal Form | — | Ball |
| Package Code | — | LFBGA |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial |
| Core Voltage | — | 0.9 V |
| Listed Operating Frequency | — | 500 MHz |
| Configuration | — | Programmable |
| REACH Status | — | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |