EP2AGX45DF29I6N vs EP2AGX45DF29I5N Vergleich

Detaillierter Direktvergleich von EP2AGX45DF29I6N von Intel und EP2AGX45DF29I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGX45DF29I6N EP2AGX45DF29I5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $185,00 $318,00
Device Family Arria II GX Arria II GX
Device Sub-family EP2AGX45 —
Logic Elements 42,960 42,959
Embedded Memory 1,728 Kbits (M9K + M144K) —
User I/O Pins 364 —
Transceiver Channels 8 (up to 6.375 Gbps) —
Hard PCIe IP PCIe Gen1/Gen2 x1/x4 endpoints —
Hard Memory Controller DDR3 (with soft PHY) —
Gehäuse 780-ball FCBGA (FineLine BGA, DF29 pin-out) —
Speed Grade 6 (fastest transceiver bin) —
Temperature Grade Industrial (-40C to +100C) —
Process Node 40 nm TSMC —
Logic Element Structure 8-input ALM (Adaptive Logic Module) —
RoHS-Status Compliant Compliant
Montageart Surface Mount (BGA) Surface Mount
Logic Array Blocks (LABs) — 1,805
Embedded Memory (M9K blocks) — 3,517,440 bits
User I/Os — 364
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Transceivers — [DATA_NEEDED: number of transceiver channels]
Max Transceiver Data Rate — 3.75 Gbps
PLLs — 4
Process Technology — 40 nm
Core Supply Voltage — 0.9 V
Betriebstemperatur — -40C to +100C (industrial)
Package Type — 780-ball FC-FBGA
Package Dimensions — 29 mm x 29 mm
MSL-Level — 3
Lead-Free — Yes

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