EP2AGX65DF29C4G vs EP2AGX65DF29C6G Vergleich
Detaillierter Direktvergleich von EP2AGX65DF29C4G von Intel und EP2AGX65DF29C6G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX65DF29C4G | EP2AGX65DF29C6G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $219,00 | $245,30 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 60,214 | 60,214 |
| Adaptive Logic Modules (ALMs) | 30,107 | — |
| Embedded Memory | 5,371,904 bits | — |
| Number of LABs/CLBs | 2,530 | — |
| User I/O Count | 364 | — |
| Number of Transceivers | 8 | 12 |
| Transceiver Data Rate | up to 3.75 Gbps (6.5536 Gbps with -4 grade using CPRI mode) | — |
| Core Voltage | 0.9 V | 0.9 V |
| Operating Frequency | 500 MHz | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Speed Grade | -4 (mid-speed) | C6 (Commercial, mid-tier) |
| Gehäuse | 780-BBGA, FCBGA (29 mm) | 780-pin FC-FBGA |
| Process Node | 40 nm (Arria II generation) | — |
| Montageart | Surface Mount | Surface Mount (Flip-Chip BGA) |
| RoHS-Status | Compliant | Compliant |
| Lead Free | Yes | — |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| Embedded Memory Bits | — | 5,371,904 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count] |
| Number of I/O | — | 364 |
| User I/O Banks | — | [DATA_NEEDED: user I/O bank count] |
| Supply Voltage Range | — | [DATA_NEEDED: full supply range] |
| Transceiver Data Rate (max) | — | 6 Gbps (C6 speed grade) |
| Number of PLLs | — | 12 |
| Number of DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Number of 18x18 Multipliers | — | 12 |
| Process Technology | — | 40 nm |
| Betriebstemperaturbereich | — | 0C to +85C (Commercial) |
| Lead-Free | — | Yes |