EP2AGX65DF29C6G vs EP2AGX65DF29C6 Vergleich
Detaillierter Direktvergleich von EP2AGX65DF29C6G von Intel und EP2AGX65DF29C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX65DF29C6G | EP2AGX65DF29C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $245,30 | $440,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 60,214 | — |
| Embedded Memory Bits | 5,371,904 | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Number of I/O | 364 | — |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Supply Voltage Range | [DATA_NEEDED: full supply range] | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (max) | 6 Gbps (C6 speed grade) | — |
| Number of PLLs | 12 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of 18x18 Multipliers | 12 | — |
| Process Technology | 40 nm | 40 nm |
| Gehäuse | 780-pin FC-FBGA | 780-ball FC-FBGA (29x29 mm) |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount (flip-chip BGA) |
| Betriebstemperaturbereich | 0C to +85C (Commercial) | — |
| Speed Grade | C6 (Commercial, mid-tier) | 6 (C6) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 60,214 |
| Logic Array Blocks (LABs) | — | 2,530 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 5,371,904 |
| Maximum User I/O | — | 364 |
| DSP Blocks (18x18 Multipliers) | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | 8 (up to 3.75 Gbps per Arria II GX family spec) |
| PLLs | — | 4 |
| Betriebstemperatur | — | Commercial (0C to +85C) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |