EP2AGX65DF29C6G vs EP2AGX65DF29C6 비교
다음의 상세 나란히 비교: EP2AGX65DF29C6G 제조: Intel 및 EP2AGX65DF29C6 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2AGX65DF29C6G | EP2AGX65DF29C6 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $245.30 | $440.00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 60,214 | — |
| Embedded Memory Bits | 5,371,904 | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Number of I/O | 364 | — |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Supply Voltage Range | [DATA_NEEDED: full supply range] | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (max) | 6 Gbps (C6 speed grade) | — |
| Number of PLLs | 12 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of 18x18 Multipliers | 12 | — |
| Process Technology | 40 nm | 40 nm |
| 패키지 | 780-pin FC-FBGA | 780-ball FC-FBGA (29x29 mm) |
| 실장 유형 | Surface Mount (Flip-Chip BGA) | Surface Mount (flip-chip BGA) |
| 동작 온도 범위 | 0C to +85C (Commercial) | — |
| Speed Grade | C6 (Commercial, mid-tier) | 6 (C6) |
| RoHS 상태 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 60,214 |
| Logic Array Blocks (LABs) | — | 2,530 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 5,371,904 |
| Maximum User I/O | — | 364 |
| DSP Blocks (18x18 Multipliers) | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | 8 (up to 3.75 Gbps per Arria II GX family spec) |
| PLLs | — | 4 |
| 동작 온도 | — | Commercial (0C to +85C) |
| MSL 레벨 | — | [DATA_NEEDED: MSL level] |