EP2AGZ225FF35I3N vs EP2AGZ225FF35I4G Vergleich
Detaillierter Direktvergleich von EP2AGZ225FF35I3N von Intel und EP2AGZ225FF35I4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ225FF35I3N | EP2AGZ225FF35I4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.655,00 | $1.450,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | — |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | Yes (per Arria II GZ family) |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Gehäuse | 1152-ball FC-FBGA | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (per distributor listing) |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Logic Elements | — | ~224,000 LE |
| Process Node | — | 40 nm |
| Number of I/O | — | 554 user I/O |
| Package Type | — | 1152-ball FineLine BGA (FBGA) |
| Package Code | — | FF35 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | I4 |
| Versorgungsspannung | — | [DATA_NEEDED: core VCC voltage] |
| Embedded Transceivers | — | Multi-gigabit (per datasheet) |
| DSP Blocks | — | Yes (per Arria II GZ family) |
| PCI Express Hard IP | — | Yes (Gen1/Gen2) |
| External Memory Interface | — | DDR3 controller (per family) |
| Lead-Free | — | Yes (per distributor listing) |