EP2AGZ225FF35I3N vs EP2AGZ225FF35I4G 对比
详细并排对比 EP2AGZ225FF35I3N 出自 Intel 和 EP2AGZ225FF35I4G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGZ225FF35I3N | EP2AGZ225FF35I4G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,655.00 | $1,450.00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | — |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | Yes (per Arria II GZ family) |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| 工作温度 | -40C to +100C (Industrial) | — |
| 封装 | 1152-ball FC-FBGA | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| MSL 等级 | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant (per distributor listing) |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Logic Elements | — | ~224,000 LE |
| Process Node | — | 40 nm |
| Number of I/O | — | 554 user I/O |
| Package Type | — | 1152-ball FineLine BGA (FBGA) |
| Package Code | — | FF35 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | I4 |
| 电源电压 | — | [DATA_NEEDED: core VCC voltage] |
| Embedded Transceivers | — | Multi-gigabit (per datasheet) |
| DSP Blocks | — | Yes (per Arria II GZ family) |
| PCI Express Hard IP | — | Yes (Gen1/Gen2) |
| External Memory Interface | — | DDR3 controller (per family) |
| Lead-Free | — | Yes (per distributor listing) |