EP2AGZ225FF35I3N vs EP2AGZ225FF35I4N Vergleich
Detaillierter Direktvergleich von EP2AGZ225FF35I3N von Intel und EP2AGZ225FF35I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ225FF35I3N | EP2AGZ225FF35I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.655,00 | $1.390,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | — |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | — |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Gehäuse | 1152-ball FC-FBGA | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL Level] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Logic Elements (LEs) | — | 224000 |
| Number of LABs/CLBs | — | 8960 |
| Total Memory Bits | — | 14248960 |
| Number of I/O | — | 554 |
| Supply Voltage - Core | — | 0.9 V |
| Maximum Operating Frequency | — | 500 MHz |
| Gehäuse / Bauform | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 mm x 35 mm |
| Lead Free / RoHS | — | Lead Free / RoHS Compliant |
| Temperature Grade | — | Industrial (I4) |