EP2AGZ225FF35I3N vs EP2AGZ225FF35I4N Comparación
Comparación detallada lado a lado de EP2AGZ225FF35I3N por Intel y EP2AGZ225FF35I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225FF35I3N | EP2AGZ225FF35I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.655,00 | $1.390,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | — |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Encapsulado | 1152-ball FC-FBGA | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL Level] |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Logic Elements (LEs) | — | 224000 |
| Number of LABs/CLBs | — | 8960 |
| Total Memory Bits | — | 14248960 |
| Number of I/O | — | 554 |
| Supply Voltage - Core | — | 0.9 V |
| Maximum Operating Frequency | — | 500 MHz |
| Encapsulado / Carcasa | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 mm x 35 mm |
| Lead Free / RoHS | — | Lead Free / RoHS Compliant |
| Temperature Grade | — | Industrial (I4) |