EP2AGZ225FF35I3N vs EP2AGZ350FH29C3N Vergleich
Detaillierter Direktvergleich von EP2AGZ225FF35I3N von Intel und EP2AGZ350FH29C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ225FF35I3N | EP2AGZ350FH29C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.655,00 | $1.920,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | 348,500 |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | 281 |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Gehäuse | 1152-ball FC-FBGA | 780-BBGA, FCBGA (FH29) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Series | — | Arria II GZ |
| Embedded Memory (bits) | — | 21,270,528 |
| Number of LABs/CLBs | — | 13,940 |
| Number of Pins / Terminals | — | 780 |
| Speed Grade | — | C3 |
| Voltage - Supply | — | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] |
| Lead-Free Status | — | Lead free |
| Process Node | — | 40 nm |