EP2AGZ225FF35I3N vs EP2AGZ350FH29C3N Comparación
Comparación detallada lado a lado de EP2AGZ225FF35I3N por Intel y EP2AGZ350FH29C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225FF35I3N | EP2AGZ350FH29C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.655,00 | $1.920,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | 348,500 |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | 281 |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Encapsulado | 1152-ball FC-FBGA | 780-BBGA, FCBGA (FH29) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Series | — | Arria II GZ |
| Embedded Memory (bits) | — | 21,270,528 |
| Number of LABs/CLBs | — | 13,940 |
| Number of Pins / Terminals | — | 780 |
| Speed Grade | — | C3 |
| Voltage - Supply | — | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] |
| Lead-Free Status | — | Lead free |
| Process Node | — | 40 nm |