EP2AGZ225HF40C4N vs EP2AGZ225HF40I3N Vergleich
Detaillierter Direktvergleich von EP2AGZ225HF40C4N von Intel und EP2AGZ225HF40I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ225HF40C4N | EP2AGZ225HF40I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.410,00 | $2.210,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 224,000 | — |
| Logic Array Blocks (LABs) | 8,960 | 8,960 |
| Adaptive Logic Modules (ALMs) | 89,600 | — |
| Embedded Memory Bits | 14,248,960 | — |
| User I/O Pins | 734 | — |
| Number of Package Pins | 1517 | — |
| Package Type | FBGA (FineLine BGA) | 1517-BBGA, FCBGA (flip-chip BGA) |
| Package Code | HF40 | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Temperature Range | -40C to +85C | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | Yes (18x19 multiplier mode) | — |
| Montageart | Surface Mount | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant | — |
| Logic Elements (LE) | — | 224,000 |
| Embedded Memory (bits) | — | 14,248,960 |
| User I/O | — | 734 |
| Embedded Multipliers (18x18) | — | 736 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Speed Grade | — | I3 (industrial, -3) |
| Betriebstemperatur | — | -40C to +100C (industrial) |
| Process Technology | — | 40 nm TSMC |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PCIe Hard IP | — | PCIe Gen1/Gen2 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |