EP2AGZ225HF40C4N vs EP2AGZ225HF40I3N Comparación
Comparación detallada lado a lado de EP2AGZ225HF40C4N por Intel y EP2AGZ225HF40I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225HF40C4N | EP2AGZ225HF40I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.410,00 | $2.210,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 224,000 | — |
| Logic Array Blocks (LABs) | 8,960 | 8,960 |
| Adaptive Logic Modules (ALMs) | 89,600 | — |
| Embedded Memory Bits | 14,248,960 | — |
| User I/O Pins | 734 | — |
| Number of Package Pins | 1517 | — |
| Package Type | FBGA (FineLine BGA) | 1517-BBGA, FCBGA (flip-chip BGA) |
| Package Code | HF40 | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Temperature Range | -40C to +85C | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | Yes (18x19 multiplier mode) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant | — |
| Logic Elements (LE) | — | 224,000 |
| Embedded Memory (bits) | — | 14,248,960 |
| User I/O | — | 734 |
| Embedded Multipliers (18x18) | — | 736 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Speed Grade | — | I3 (industrial, -3) |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Process Technology | — | 40 nm TSMC |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PCIe Hard IP | — | PCIe Gen1/Gen2 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |