EP2AGZ300FF35C4G vs EP2AGZ300FF35C4N Vergleich

Detaillierter Direktvergleich von EP2AGZ300FF35C4G von Intel und EP2AGZ300FF35C4N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ300FF35C4G EP2AGZ300FF35C4N
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.240,00 $1.350,00
Family Arria II GZ —
Logic Elements 300,000 298,000
Adaptive Logic Modules (ALMs) 119,000 —
Embedded Memory 16,624 Kbit (M9K + M144K) —
Embedded 18x18 Multipliers 736 —
User I/O Pins 554 —
Transceivers 12 channels Multi-gigabit transceivers integrated
Max Transceiver Data Rate 6.375 Gbps (C4 speed grade) —
Gehäuse 1152-ball FineLine BGA (FBGA-1152), 35x35 mm —
Betriebstemperatur 0°C to +85°C (commercial C4 grade) —
Speed Grade 4 —
Process Technology 40 nm TSMC 40 nm
Core Voltage 0.85 V to 1.1 V 0.9 V
PLLs 8 (up to 4 per quadrant) [DATA_NEEDED: PLL count]
Global Clock Networks 16 —
PCIe Hard IP PCIe Gen2 x4 —
Hard Memory Controller DDR3 up to 800 MHz —
Configuration Passive Serial, Fast Passive Parallel, JTAG —
RoHS-Status Compliant Compliant (per Besenchips / DigiKey listing)
MSL-Level 3 (168 hours) —
Series — Arria II GZ
Logic Array Blocks (LABs) — 11,920
Embedded Memory (bits) — 18,854,912 (~17.9 Mbit)
User I/O Count — 554
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Package Type — 1152-BBGA, FCBGA (flip-chip)
Terminal Form — Ball
Package Code (JEDEC) — HBGA
Operating Temperature Grade — Commercial (C4 = 0C to +85C)
Configuration Memory — SRAM-based (volatile, requires boot device)
DSP Blocks — [DATA_NEEDED: number of DSP blocks]
Lead-Free Status — Lead free (per Besenchips listing)
Montageart — Surface Mount
Maximum Operating Frequency — 500 MHz

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern