EP2AGZ300FF35I3G vs EP2AGZ300FF35I4 Vergleich
Detaillierter Direktvergleich von EP2AGZ300FF35I3G von Intel und EP2AGZ300FF35I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FF35I3G | EP2AGZ300FF35I4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.230,00 | $1.015,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 300000 | — |
| Number of User I/O | 554 (maximum) | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Process Node | 40 nm | — |
| Betriebstemperatur | -40C to +100 C (I3 industrial) | — |
| Gehäuse | 1152-ball FBGA (FF35) | 1152-ball FC-FBGA (FF35) |
| Montageart | Surface Mount | Surface Mount (flip-chip BGA) |
| Versorgungsspannung | [DATA_NEEDED: core and I/O supply voltage values] | — |
| Embedded Memory (Mbits) | 16.4 | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks] | Hard DSP columns (variable precision) |
| PLLs | [DATA_NEEDED: number of PLLs] | — |
| Memory Interfaces | DDR3, QDRII+, RLDRAM II | — |
| Configuration Method | Serial, Parallel, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (168 hours) | — |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 298,000 |
| Configurable Logic Blocks (LABs/CLBs) | — | 11,920 |
| Maximum User I/O | — | 554 |
| Operating Frequency (Max) | — | 500 MHz |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (-40 C to +100 C) |
| Number of Pins/Balls | — | 1152 |
| Terminal Form | — | Ball (BGA) |
| Transceivers | — | 12.5 Gbps integrated |
| Embedded Memory | — | M20K blocks (distributed) |
| PCIe Support | — | PCIe Gen2 hard IP |